规格
- 零件状态 Active
- 位置数量 16
- 材料 -
- 尺寸/外形尺寸 -
- 间距 -
- 板厚 -
- 原型板类型 SMD to DIP
- 封装验收通过 DPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-16
- RoHS Status Not applicable
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 8534.00.0070
