规格
- 零件状态 Active
- 材料 FR4 Epoxy Glass
- 位置数量 64
- 原型板类型 SMD to DIP
- 间距 0.020" (0.50mm)
- 板厚 0.063" (1.60mm)
- 封装验收通过 HTQFP
- 尺寸/外形尺寸 3.400" L x 1.000" W (86.36mm x 25.40mm)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 8534.00.0040
