规格
- 零件状态 Active
- 间距 0.039" (1.00mm)
- 材料 FR4 Epoxy Glass
- 原型板类型 SMD to DIP
- 板厚 0.063" (1.60mm)
- 封装验收通过 -
- 位置数量 69
- 尺寸/外形尺寸 3.500" L x 0.900" W (88.90mm x 22.86mm)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH info available upon request
- ECCN EAR99
- HTSUS 8534.00.0070
