DLP5532AFYSQ1
规格
- 安装类型 Through Hole
- 零件状态 Active
- 应用领域 -
- 可编程 Not Verified
- 类型 tal Micromirror Device (DMD)
- 封装 / 外壳 149-BFCPGA Exposed Pad
- 供应商器件封装 149-CPGA (22.3x32.2)
- RoHS Status Not applicable
- Moisture Sensitivity Level (MSL) Not Applicable
- ECCN EAR99
- HTSUS 8542.39.0060
