规格
- 零件状态 Active
- 材料 -
- 位置数量 6
- 尺寸/外形尺寸 -
- 间距 -
- 板厚 -
- 原型板类型 SMD to Plated Through Hole
- 封装验收通过 MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 8534.00.0095
